[KODMIC]KODMIC Signs MOU to Build AI Marketing Platform[KODMIC Newsletter April 16, 2026 (No. 792)]
2026-05-21 15:45:11
18 읽음
Aligning with KBIZ Innovative Joint Project to Establish AI-Based Exhibition Management System
KODMIC signed a Memorandum of Understanding (MOU) with IPNow (CEO Cha-dong Hwang), an AI specialized
company, on April 9 (Thu) to integrate AI into 'INTERMOLD KOREA 2027' and upgrade overall exhibition operations.
Following its selection for the "Innovative Joint Project for Small and Medium Business Cooperatives" supported by the Korea Federation of Small and Medium Business (KBIZ),
KODMIC is pushing forward with the establishment of the 'Mold Industry AI Marketing Platform.' As part of this initiative, KODMIC has partnered with IPNow.
Through this partnership, KODMIC plans to improve exhibition operation efficiency by building an AI-based marketing platform—including an AI-driven buyer matching system and AX (AI Transformation) for general administrative tasks. Concurrently, it aims to vitalize global marketing for the domestic mold industry and generate new market demand.
Chairman Yong-mun Shin stated, "INTERMOLD KOREA is a flagship exhibition that forecasts the future of the domestic die and mold industry. By introducing an AI-based marketing platform and workflow automation through this agreement, we will enhance operational efficiency and provide substantial support in expanding business opportunities for participating exhibitors."
He added, "KODMIC will continuously drive digital-based innovations to sharpen the competitiveness of the mold industry and advance the sophistication of our exhibitions."